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ZEISS / CARL ZEISS

PROVE COMPACT

Contact for Price
Year
N/A
Operational
Unknown
Install
Uninstalled - Crated
Location
United States
01Description

About this asset

Reticle/Mask Defect Inspection System

02Configuration

Configuration

·      Factory Interface (FI) with 1 loadport for SMIF pod RSP-200 ·      Separate electronic cabinets reduce footprint of main tool and separates heat generation sources. ·      Separate pre climatization unit to supply conditioned air for main chamber environment control. ·      Operator desk with dual monitors for simultaneous view of tool PC and station controller. ·      Transfer Chamber o   6 axis external handling robot for moving masks from loadport to library to internal handling systems o   Internal handling robot interfaces with fine alignment station for accurate mask edge detection. o   Mask library can accommodate 10 masks within the tool at any time. ·      Process Chamber o   Temperature and humidity controlled chamber o   Ultra precision stage for measuring mask in face up position. o   Stage rests on advanced damping devices to achieve optimal registration repeatability. ·      Imaging optics o   193nm excimer source with a 25um field of view capable of registration measurements in both reflection and transmission mode o   Capable of through pellicle measurements for optical masks. o   Red vis camera for coarse alignment and mask position measurements. o   Measurement speed is 600 sites per hour with 5 plane measurements and up to 1000 sites per hour with 1 plane measurement ·      Performance for both reflection and transmission mode measurements: o   Long term registration repeatability of < 0.55nm with first order corrections and <0.8nm with 0th order corrections o   Registration accuracy < 0.95nm o   Screen linearity < 1nm o   Centrality repeatability <10um ·       Additional details available upon request

05About

About ZEISS / CARL ZEISS PROVE COMPACT

ZEISS is the global technology leader in the production of systems and modules for microchip production. With semiconductor manufacturing optics, photomask systems and process control solutions, ZEISS supplies key technologies for the production of ultra-fine conductor track structures on silicon wafers – the raw material used to make microchips. Advances in computer technology largely rely on the ongoing development of optical lithography – every new generation enables even finer structures to be produced on the microchips. This makes circuits more compact, resulting in more powerful and more energy-efficient microchips every year. ZEISS has been driving the development of semiconductor manufacturing technology right from day one. ZEISS’ new and unique extreme ultraviolet (EUV) lithography has created a series of further generations of microchips with ever greater integration density and performance.

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